Part Ⅰ History of Electroless Plating

1．History-From the Discovery of Electroless Plating to the Present

1.1 Discovery of Electroless Plating

1.1.1 EarlyWorks

1.1.2 Brenner and Riddell's Work

1.2 Early Stage of Development(1940s-1959)

1.2.1 Research Works

1.2.2 Patents Issued

1.2.3 Preliminary Applications

1.3 Slow Growth of Period(1960-1979)

1.3.1 Improvement of the Plating Bath

1.3.2 Various Electroless Plating Metals

1.3.3 Electroless Plating Cu

1.3.4 Deposition Substrate

1.3.5 Application

1.4 Rapid Development of Period(1980-1999)

1.4.1 Studying the Nature of Electroless Plating

1.4.2 Studying the Properties of Electroless Plating Deposits

1.4.3 Large-Scale Application in Many Industries

1.4.4 Investigation of Temary and Multicomponent Alloys and Composites

1.4.5 Electroless Plating Began and Developed Rapidly in China

1.4.6 Electroless Plating Fe-B Based Alloys Have Been Proposed and Developed

1.5 In-Depth Development and Nanoelectroless Plating Stage(2000-Present)

1.5.1 In-Depth Investigation of the Mechanism and Theory in Electroless Plating

1.5.2 Rapid Development of Nanoelectroless Plating

1.6 Summary and Prospect

References

Part Ⅱ Technology of Electroless Plating-Plating Bath,Critical Parameters, Deposition Rate,and Stability of Plating Bath

2．Electroless Plating Baths of Metals,Binary Alloys,and Multicomponent Alloys

2.1 General Consideration for Electroless Plating Bath Solution

2.2 Plating Bath of Electroless Pure Nickel and Nickel-Based Binary Alloys

2.2.1 Pure Ni and Co Metals

2.2.2 Ni-P

2.2.3 Ni-B

2.3 Cobalt-Based Binary Alloys

2.3.1 Co-P

2.3.2 Co-B

2.4 Cu and Copper-Based Binary Alloys

2.5 Au

2.6 Ag

2.7 Pd and Palladium-Based Binary Alloys

2.8 Pt and Platinum-Based Binary Alloys

2.9 Ru,Rh,Os,and Cr-P Binary Alloys

2.10 Group B Metals(Zn,Cd,In,Sn,Pb,As,Sb,and Bi)and a Few Binary Alloys of these Metals

2.11 Electroless Plating of Ternary Alloys

2.11.1 Ni-Me-P Alloy Plating Baths

2.11.2 Co-Me-P Alloy Plating Baths

2.11.3 Ni-Me-B Alloy Plating Baths

2.11.4 Co-Me-B Alloy Plating Baths

2.11.5 Other Ternary Alloy Plating Baths

2.12 Electroless Plating of Quaternary Alloys

2.12.1 Ni-Based Quaternary Alloy Plating Baths

2.12.2 Co-Based Quaternary Alloy Plating Baths

2.13 Electroless Plating Quinary and Multialloys

2.14 Summary

References

3．Electroless Composite Plating

3.1 General Considerations about ECP

3.2 Bath Solutions of ECP

3.2.1 Bath for Binary Alloy-Based ECP

3.2.2 Bath for Ternary Alloy-Based ECP

3.2.3 Bath for ECP With Two Kinds of Particles

3.3 Summary

References

4．Nano Electroless Plating

4.1 Bulk Nano EP Materials

4.1.1 Nano ECP

4.1.2 EP Three-Dimensional Nanostructured Materials(3D NSMs)

4.2 2D Nano EP Materials

4.2.1 EP 2D Nano Films

4.2.2 EP 2D Nanoplates

4.2.3 EP 2D Nanodisks

4.2.4 EP 2D Nanoshells and Nanosheets

4.2.5 EP 2D Nanowalls

4.2.6 EP 2D Nano Ci rcles and Rings

4.2.7 EP 2D Nanohoneycomb

4.2.8 EP 2D Nanoline,Nanofin Pattern,and 2D Nano Grating

4.3 Linear(1D)Nano EP Materials

4.3.1 EP Nanotubes

4.3.2 EP Nanowires

4.3.3 EP Nanorods

4.3.4 EP Nanobelts

4.4 Zero-Dimensional Nano EP Materials

4.4.1 EP Nanoparticles

4.4.2 EP Nanoparticle Arrays

4.4.3 EP Nanoparticles Other Than Spherical Shape

4.4.4 EP Core-Shell Nanoparticles

4.5 Summary

References

5. Electroless PlatingFe-Based Alloys

5.1 Why Electroless Plating Fe-B Alloys?

5.2 Discovery of EP Fe-B Alloys

5.2.1 The Plating Bath and Affective Parameters

5.2.2 Analysis of the Difficulty in Obtaining EP Fe-B Alloys

5.2.3 Composition,Structure,and Properties of EP Fe-B Alloys

5.2.4 Formation Mechanism of EP Fe-B Alloys

5.2.5 Problems and Worthwhile Improvements for EP Fe-B Alloys

5.3 EP Binary Fe-B Alloys

5.4 EP Fe-B-Based Multicomponent Alloys

5.4.1 EP Fe-W-B Alloy Deposits

5.4.2 EP Fe-Mo-B Alloy Deposits

5.4.3 EP Fe-Sn-B Alloy Deposits

5.4.4 EP Fe-W-Mo-B Alloy Deposits

5.4.5 EP Fe-Ni-B Alloy Deposits

5.5 EP Fe-PAlloys

5.6 EP Fe-P-Based Ternary-Component Alloys

5.7 Summary

References

6．Impact Parameters and Deposition Rate

6.1 Effects of Plating Bath Components on Deposition Rate

6.1.1 Effect of Metal Salts

6.1.2 Effect of Reducing Agent

6.1.3 The Effect of Complexing Agent

6.1.4 Effect of Stabilizer

6.1.5 Effect of Accelerating Agent

6.1.6 The Effect of Surfactants

6.2 Effects of Operating Conditions

6.2.1 Effect of pH Value

6.2.2 Effect of Plating Temperature

6.2.3 Effect of Plating Time

6.3 Effects of other Technological Parameters

6.3.1 Effect of Stirring

6.3.2 Effect of Magnetic Field

6.3.3 Effect of Bath Loading

6.4 Summary

References

7．Green Electroless Plating

7.1 What is Green Electroless Plating?

7.2 Green Electroless Plating of EN

7.3 Green Electroless Plating on Cu

7.3.1 Hypophosphite

7.3.2 Glyoxylic Acid

7.3.3 DMAB

7.3.4 Sodium Bisulfate

7.3.5 Co2+ and Fe2+

7.3.6 Saccharide

7.3.7 Green Ligand for EP Cu

7.4 Green Electroless Plating Ag

7.5 Green Electroless Plating Au

7.6 Summary

References

Part Ⅲ Composition,Microscopic Structure,and Surface Morphology of Electroless Deposits

8．Composition and Microstructure

8.1 Composition and Microstructures of EP Alloy Deposits

8.1.1 Ni-P Alloy Deposits

8.1.2 Other EP Binary Deposits

8.1.3 Binary Alloy-Based ECP Deposits

8.2 Composition and Microstructures of EP Ternary and Multicomponent Alloy Deposits

8.2.1 Effects of Metal Salts on Composition and Structure in Ternary and Quaternary Alloy Coatings

8.2.2 Effects of Reductant on Composition and Structure in Ternary and Quaternary Alloy Coatings

8.2.3 Effects of Complexing Agents on Composition and Structure in Ternary and Quaternary Alloy Coatings

8.2.4 Effects of pH Value on Composition and Structure in Ternary and Quaternary Alloy Coatings

8.2.5 Effects of Temperature on Composition and Structure in Ternary and Quaternary Alloy Coatings

8.2.6 Influence of Ultrasound on Composition and Structure of EN Deposits

8.3 Crystallization of EP Amorphous Alloys

8.3.1 Crystallization Process and Products of EP Alloys Deposits

8.3.2 Crystallization Temperature and Activation Energy of EP Alloy Deposits

8.3.3 Crystallization Transformation Kinetics of EP Alloy Deposits

8.4 Summary

References

9．Surface Morphologies

9.1 Skeleton Understanding of Surface Morphologies of the EP Alloy Coatings

9.1.1 What Magnification Can See the Morphology Clearly?

9.1.2 What Are the Morphological Features for Ni-P Based Alloy Deposits?

9.1.3 What is the Influence of Alloying Elements on the Surface Morphology of Ni-P Based Alloy Deposits?

9.1.4 Is there a Quantitative RelationshiP Between the Particle Size and Alloy Composition?

9.1.5 Should the Surface Morphology of Electroless Amorphous Coatings Be a Distinctive Pattern or Featureless?

9.2 The Effect of Alloying Elements on SEM

9.2.1 The Surface Morphology of EP Pure Metals

9.2.2 The Surface Morphology of EP Binary Alloy Films

9.2.3 The Surface Morphology of EP Multicomponent Alloy Films

9.3 Surface Morphology of ECP Alloy Deposits

9.4 Effects of Various Parameters on SEM

9.4.1 Effects of the Concentration of Metal Salts on SEM

9.4.2 Effects of Reductant on SEM

9.4.3 Effects of Complexing Agents on SEM

9.4.4 Effects of Stabilizers on SEM

9.4.5 Effects of Surfactants on SEM

9.4.6 Effects of pH Values on SEM

9.4.7 Effects of Plating Temperature on SEM

9.4.8 Effects of Plating Time on SEM

9.4.9 The Effects of Heat Treatment on SEM

9.5 Summary

References

Part Ⅳ Kinetics,Mechanism,and Theory of Electroless Plating

10．Mechanism of Electroless Plating

10.1 The Existing Reaction Mechanism of EP Deposits

10.1.1 The So-Called Four Classical Mechanisms

10.1.2 Mixed Potential Theory

10.1.3 The Uniform Electrochemical Mechanism

10.2 Shortcomings and Deficiencies of Existing Reaction Mechanisms of EP Deposits

10.3 Kinetics and Recent Progress

10.3.1 Real-Time Monitoring of Initial EP

10.3.2 Microstructure in Initial Stage of EP

10.3.3 Kinetics and Empirical Modeling of EP

10.4 Summary

References

11．Formation Theory and Formation Range of Electroless Amorphous Alloys

11.1 General Description of Formation of Electroless Amorphous Alloys

11.2 Formation Theory of Electroless Amorphous Alloys

11.2.1 A Brief Retrospect of the Quantitative Theory of Metallic Glass Formation

11.2.2 Formation Theory of Electroless Amorphous Alloy Systems

11.3 Formation Range of Electroless Amorphous Alloys:Experimental Facts and Theoretical Calculations

11.3.1 Experimental Data of RAF of EP Amorphous Alloys

11.3.2 Theoretical Calcu lation of RAF of EP Amorphous Alloys

11.4 Summary

References

12．Microscopic Theory of Electroless Plating

12.1 Why Use the Microscopic ab initio Theory to Investigate the EP Process?

12.2 Ab initio Computational Methods

12.2.1 Calculation Methods and Program Package

12.2.2 Selection of the Basis Sets

12.2.3 Selection of Oxidation Pathway

12.2.4 Solvation Effect

12.2.5 Catalytic Activity of Metal Surfaces

12.3 Theoretical Results Obtained by Ab Initio Methods

12.3.1 Reaction Mechanisms of EP Processes for Various Reductants

12.3.2 Detailed Investigation of Atomic Interaction Between Reductants and Metal Surfaces

12.3.3 The Role of Stabilizer and Plating Rate in EP

12.4 Summary and Prospective

References

Index